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microelectronic packaging中文什么意思
例句與用法
- The industry of microelectronic packaging equipments
微電子封裝設(shè)備市場(chǎng)分析 - Because the calculation of j - integral is much simpler than other method , and the multilayers and interfaces are ubiquitous in microelectronic packaging structures , it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging , especially
并通過(guò)實(shí)例證明，此新方法對(duì)于界面分層問(wèn)題是可行的。由于j積分計(jì)算十分簡(jiǎn)便，因此扁平小矩形路徑j(luò)積分方法有望在電子封裝分層能量釋放率計(jì)算中得到廣泛的應(yīng)用。
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